
Semi-sintering die attach adhesives
The characteristics of semi-sintering die attach adhesives series products:
1. One component packaging, easy to use;
2. Suitable for dispensing, printing process;
3. Good control of viscosity and thixotropic;
4. Low RBO performance, low temperature sintering;
5. Applicable to Non-BSM(Non-Back side Metallization) die surface;
6. High electrical conductivity, high thermal dissipation, high reliability;
7. Low extractable ionic content.