Silver sintering die attach adhesives

Model: GD-9018SDA, GD-8166SDA, GD-8301SDA

Silver sintering die attach adhesives: Used for die attach in packaging of substrates or leadframe. Has high electrical conductivity and thermal conductivity, and can maintain good strength at 260℃. Used for surface bonding of gold, silver, and copper.

Typical applications：die attach of high-power packaging.

Functions: die attach, electrical interconnect, thermal dissipation.