Low temperature curing adhesives: This products are one component modified epoxy adhesives, and can low temperature fast cure. It offers excellent adhesion between a variety of different types of materials at low temperature and in a short curing time. The products have excellent workability performance and relatively high storage stability.

Typical applications: bonding and reinforcement in electronic and industrial industries. It can be used in situations where rapidly curing are required and in applications of temperature sensitive components. Typical applications include camera module assembly, LED light bar lens bonding, electronic components reinforcement, etc.

Underfill: one component heat curing epoxy adhesive, which can fill the gap between the chip and the substrate to form a uniform filling layer by capillary, effectively reduce the stress caused by the mismatch of their thermal expansion coefficients, improve the mechanical strength of solder ball connection, and improve the resistance of impact caused by external forces.

Typical applications: Board level underfill of BGA, CSP and QFN devices, used in mobile phones, tablets and laptops, such as fingerprint modules, mainboard, display screen, battery protection board chip, etc.

Functions: improve the mechanical reliability of the solder ball, reduce the stress, improve the drop resistance of the device.

Thermally Conductive Gap Filler: It is a silicone product used for filling between heat source devices and heat dissipation device, helping heat transfer between two surfaces, and can significantly reduce the thermal resistance between them.

Typical applications: heat dissipation of heat source devices in the industrial electronics and consumer electronics, widely used in automotive electronics, handheld intelligent terminals, computers, telecommunications, household appliances, industrial automation and other industries.

Structural bond adhesives: there is no uniform definition of structural adhesive, which generally refers to the adhesives used in the applications of requiring to bear large loads and providing firm and durable bonding and sealing effects, covering a wide range of areas. Classification according to chemical type of materials, there are acrylic acid, epoxy, polyurethane, etc. Among them, the epoxy structural adhesive is one of the most widely used adhesives. Classification according to packaging form, there are one component structural adhesive and two-component structural adhesive.

Typical applications: bonding in electronic and industrial industries, widely used in automobile, civil industry, electronics, construction, consumer goods and other industries. Covers the surface bonding and potting of metals, plastics, composites and other different materials.

UV curable adhesives: one component adhesive, generally free of solvent, which can be quickly cured when exposed to UV light/partial visible light. UV curable acrylic adhesive is generally composed of oligomer resin, monomer, initiator and additives. According to the resin types, the products can be classified into acrylic, epoxy and silicone UV adhesives. 

Typical applications: bonding, sealing and coating protection in electronic and industrial industries, applicable to optical, consumer electronics, automotive and other industries.

Electrically conductive adhesive: It can be used to bond different materials for electrical connecting, thermal management and structural bonding. According to resin systems of materials, it can be classified as epoxy, silicone, acrylic conductive adhesive, etc. The epoxy conductive adhesive is most one of them. According to packaging forms, it can be classified as one component conductive adhesive and two-component conductive adhesive. One component conductive adhesive is most one of them.

Typical applications: Chip bonding, and as an alternative to solder, etc., can be used in consumer electronics, automotive, medical, communications, aerospace and other industries.