Low temperature curing adhesives
Low temperature curing adhesives: This products are one component modified epoxy adhesives, and can low temperature fast cure. It offers excellent adhesion between a variety of different types of materials at low temperature and in a short curing time. The products have excellent workability performance and relatively high storage stability.
Typical applications: bonding and reinforcement in electronic and industrial industries. It can be used in situations where rapidly curing are required and in applications of temperature sensitive components. Typical applications include camera module assembly, LED light bar lens bonding, electronic components reinforcement, etc.
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