Solutions
Low viscosity, fast curing at low temperature, in a variety of types of material between the formation of excellent stick relay and has good flexibility, high storage stability.
Flexible circuit board (FPC) fixed bonding, flexible panels, OLED, PUR bracelet and so on, the fingerprint recognition module used in camera module component adhesive bonding, LED lens, FPC adhesives, etc.
GD - 250 GD - 281 series
80 ℃ curing 5 ~ 10 min；
70 ℃ curing 15 ~ 25 min；
60 ℃ curing 25 ~ 35 min；
Note: heating binding site may need a certain amount of time so as to achieve the curing temperature. Curing conditions will be different because of different devices.
- One component fast curing, easy to operate
- Good adhesion to glass, FPC, metal and other substrates
- Table dry, excellent environmental performance
Used in medical equipment, flexible circuit board (FPC) fixed adhesive, PFC original protection, battery protection board, fingerprint recognition module, camera module (AA process).
It is applied to panels and frames of mobile phones, tablets and electronic wearable products
Structural bonding of frame and back cover
The main function of the product: wafer sealing sealing protection
Used in telephones, toys, calculators, LDC, printers, etc
Anaerobic high strength fast curing acrylic adhesive,
specially designed for high temperature rigid assembly bonding with GD-50 can accelerate curing, used in speaker magnet and frame, magnet and Worths bonding.
Product main function: plastic and plastic, plastic and metal, metal and metal bonding.
Applied to the shell and frame bonding of electronic products.
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