• Home
  • About
    • Company Profile
    • Organizational Structure
    • Yearbook
    • Awards
    • Company Culture
    • Facility
  • News
    • Corporate News
    • Industry Newsletter
  • Product
      • Low temperature curing adhesives
      • Broad Level Underfill
      • Thermally conductive gap filler
      • Structural bonding adhesives
      • UV curable adhesives
      • Electrically Conductive Adhesives
      • GD-815INK,GD-826INK,GD-813INK,GD816INK,GD-803INK
  • Technology
    • Solutions
    • Conference
    • FAQ
  • Join Us
  • Contact Us
  • 中文
Corporate News

第五届上海创新创业青年50人论坛松江分论坛颁奖

2024-10-28
1836

                                     我司总经理徐仕徽受邀参加第五届上海创新创业青年50人论坛松江分论坛颁奖

                                                                                            微信图片_20241028094155-1.jpg

                                                                                           微信图片_20241028094211.jpg


                                                                                           微信图片_20241028094215-1.jpg

                                                                                           微信图片_20241028094219-1.jpg

ASE Group(日月光集团)与道尔化成电子材料(上海)有限公司签订战略合作伙伴协议
上海工技大产学研结合大会颁奖
  • Address: No. 188 Zhongchen Road, Songjiang District, Shanghai City
  • Telephone : +86 021 6806 1656
  • Fax: +86 021 8034 1996
About
  • Company Profile
  • Organizational Structure
  • Yearbook
  • Awards
  • Company Culture
  • Facility
Product
    • Low temperature curing adhesives
    • Broad Level Underfill
    • Thermally conductive gap filler
    • Structural bonding adhesives
    • UV curable adhesives
    • Electrically Conductive Adhesives
    • GD-815INK,GD-826INK,GD-813INK,GD816INK,GD-803INK
Solutions
  • Low temperature curing adhesive applications
  • UV glue application program
  • PUR hot melt adhesive application scheme
  • Structural adhesive & Application of anaerobic structural adhesive
  • COB Bunding application scheme
News
  • Corporate News
  • Industry Newsletter
Keep in touch
  • Join Us
  • Contact Us
Dover Wechat Dover Wechat

About | News | Product | Contact Us


沪ICP备2021022248号-1 沪(松)应急管危经许[2022]203092
Copyright © 2021 - 2024 道尔化成电子材料(上海)有限公司. 版权所有  
dover
  • Home
  • About
    • Company Profile
    • Organizational Structure
    • Yearbook
    • Awards
    • Company Culture
    • Facility
  • News
    • Corporate News
    • Industry Newsletter
  • Product
    • Low temperature curing adhesives
    • Broad Level Underfill
    • Thermally conductive gap filler
    • Structural bonding adhesives
    • UV curable adhesives
    • Electrically Conductive Adhesives
    • GD-815INK,GD-826INK,GD-813INK,GD816INK,GD-803INK
  • Technology
    • Solutions
    • Conference
    • FAQ
  • Join Us
  • Contact Us
About Product News Contact Us