Low-viscosity, high-reliability underfill encapsulant
Low-viscosity, high-reliability underfill encapsulant: It utilizes capillary action to fill the gap between the chip and the substrate, forming a uniform underfill layer. It effectively reduces the stress caused by the mismatch in thermal expansion coefficients between the chip and the substrate, improves the mechanical strength of solder joint connections, enhances the ability to resist impacts caused by external forces, and mitigates the effects of moisture.
Typical Applications： Board-level underfill for BGA and CSP devices.
Functions: Improve the mechanical reliability of solder balls, reduce stress, enhance the drop resistance of devices, and mitigate the impact of moisture.
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