Broad Level Underfill
Underfill: one component heat curing epoxy adhesive, which can fill the gap between the chip and the substrate to form a uniform filling layer by capillary, effectively reduce the stress caused by the mismatch of their thermal expansion coefficients, improve the mechanical strength of solder ball connection, and improve the resistance of impact caused by external forces.
Typical applications: Board level underfill of BGA, CSP and QFN devices, used in mobile phones, tablets and laptops, such as fingerprint modules, mainboard, display screen, battery protection board chip, etc.
Functions: improve the mechanical reliability of the solder ball, reduce the stress, improve the drop resistance of the device.
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