One component encapsulants

Model: GD-1150EN、GD-1156EN、GD-8181EN

One component encapsulants: Designed to protect circuit boards and their components from the effects of heat, moisture, dust, and mechanical stress. Common forms include Dam-fill and Glop top (COB, chip on board) encapsulation. Good adhesion to various substrates.

Typical applications：Dam and fill encapsulation and Glop top (COB) encapsulation.

Functions: Protect the device from water vapor, corrosion, etc., and improve its resistance to mechanical vibration