Low temperature curing adhesives
Low temperature curing adhesives: This products are one c...
Broad Level Underfill
Underfill: one component heat curing epoxy adhesive, which can fill the gap between the ch...
Structural bonding adhesives
Structural bond adhesives: there is no uniform definition of structural adhesive, which ge...
UV curable adhesives
UV curable adhesives: one component adhesive, generally free of solvent, which can be quic...
Electrically Conductive Adhesives
Electrically conductive adhesive: It can be used to bond different materials for electrica...
Semi-sintering die attach adhesives
The characteristics of semi-sintering die attach adhesives series products:
1. One componen...
Silver sintering die attach adhesives
Silver sintering die attach adhesives: Used for die attach in packaging of substrates or lea...
Silver sintering die attach adhesives
Electrically insulating die attach adhesives: Design for packaging die attach of substrate o...
One component encapsulants
One component encapsulants: Designed to protect circuit boards and their components from the effe...
UV and thermal dual cure adhesives
UV and thermal dual cure adhesives: UV light cure and thermal cure to achieve complete curing. UV...
Two-Component Adhesives
Two-component adhesives: Two-component adhesive relies on the chemical reaction that occurs when...
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