• Address: No. 188 Zhongchen Road, Songjiang District, Shanghai City
• Telephone : +86 021 6806 1656
• Fax: +86 021 8034 1996

About

• Company Profile
• Organizational Structure
• Yearbook
• Awards
• Company Culture
• Facility

Product

• • Low temperature curing adhesives
  • Broad Level Underfill
  • Structural bonding adhesives
  • UV curable adhesives
  • Electrically Conductive Adhesives
  • Semi-sintering die attach adhesives
  • Silver sintering die attach adhesives
• • Insulating die attach adhesives
  • One component encapsulants
  • UV and thermal dual cure adhesives
  • Two-Component Adhesives
  • PUR Hot Melt Adhesives
  • Silicone adhesives
  • Nano Conformal Coating

Solutions

• Low temperature curing adhesive applications
• UV glue application program
• PUR hot melt adhesive application scheme
• Structural adhesive & Application of anaerobic structural adhesive
• COB Bunding application scheme

News

• Corporate News
• Industry Newsletter

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